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Fall 2011 Instructor: TBA
Course Description
This course will deal with the practical engineering aspects of micro-machining technologies and microsystems. The contents will include: scaling issues, microfabrication technologies and production methods, classification and analysis of Microsystems (including microsensors, microactuators, RF switches, micromirrors, and other micromechanisms), the integration of devices into Microsystems (both assembly and interfacing). Micro-machining will be compared and contrasted to both micro-electronics and traditional macro-machining. The development and use of Microsystems simulation and design tools will be covered as well. (0/0/0/25/17)
Time & Location: TBA
Textbooks
No textbook is absolutely required but the following can be used as
references:
1. C. Liu 2006 Fundations of MEMS. Upper Saddle
River, NJ: Pearson Education Inc.
2. J. W. Gardner, et al, 2002, Microsensors, MEMS and Smart Devices, Wiley.
3. S. S. Saliterman, 2005 Fundamental of BioMEMS and Medical Microdevices, Wiley-Interscience, SPIE
Press.
Examples of Microdevices
Labs
The lab will be carried out at MEMS laboratory in the second floor of Jackson Hall. Whether all labs will be conducted in groups or individua is to be determined based on class size. The lab consists of testing some MEMS devices which were fabricated using commercial processes.
Grading Scheme
| Labs | 10% |
| Reading Presenation | 10% |
| Assignment | 10% |
| Midterm | 20% |
| Final Exam | 20% |
| Project | 30% |
Size of MEMS devices